Cooperation

INTERNATIONAL COLLABORATION

Joint Programs

In order to foster international IC talents, the school has signed agreements in succession with Ecole Nationale Supérieure des Mines de Saint Etienne (ENSMSE, France), Concordia University (Canada), University of Washington (USA), the National University of Singapore etc. for joint educational programs. Learn more joint programs, CLICK HERE.

Since 2005, with the international aid programs, over 40 students have been sent abroad to further their study or receive credits both in China and abroad. Dozens of foreign experts are invited to give technical seminars including six IEEE Fellow Speakers to the school.

Summer School

Chinese-German Summer School is a science communicating activity held by Friedrich-Alexander-University Erlangen-Nuernberg, Tongji University and Shanghai Jiao Tong University.

Learn more, please CLICK HERE.

International Conferences sponsored by SoME

 

 

Industry Collaboration

 

SoME has established various collaborations with many international famous companies, such as Intel, IBM, SMIC, Xilinx, Teradyne, Cadence, Synopsys and so on. The collaboration include joint courses, joint labs, university donations, joint research projects, technology forums, industry sponsored competitions, scholarship and internship. The collaboration brings SoME students to the front of a whole IC industry chain including design, fabrication, packaging and testing.

Recent Events

  • Agreement of Joint Master Engineering program signed by SoME and TI in 2010;
  • Teradyne-SJTU Semiconductor Test laboratory was found in 2009;
  • Xilinx-SJTU FPGA Laboratory was found in 2007;
  • Agreement of Joint-Master program signed by SoME and SPREADTRUM in2007;
  • Intel-SJTU Joint course started in 2005;
  • Agreement of Joint-Master Engineering program signed by SoME and SMIC in 2004;
  • SoME Summer school Program and IC competition were sponsored by companies such as SMIC, Intel, Samsung, Freescale, Huawei, SISCO, Spreadtrum, TI etc.
  • SoME received University donations from Xilinx, ADI, Actel etc.
  • Research Cooperation Agreement Signed by Huawei, Beiling etc.
  • Lab Co-found Agreement Signed by SoME and 8th Research Institute of China Aerospace Science and Technology Cooperation;